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Hi,
Like everybody (?) we are using 0805 components in wavesoldering.
When there is a viahole in the pad, we see a number of very thin
solderjoints (almost undetectable visually) and even non-soldered
components.
Is there an experience in the field about allowing or not allowing this
configuration, and about via-hole size and via-position in the pad to
reduce or prevent defects ?
Eddie Van Horen [log in to unmask]
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