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Date: | Tue, 29 Apr 97 11:41:13 |
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IPC-CM-770 -20.4.2.5 and table 20-4 provide information concerning Adhesives.
-23.0 outlines Chip on Board (COB) technology
Good luck,
thom
Excel Inc.
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Subject: ASSEM: torsion/strength of soldered and glued SMD components
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Organization: SPA Nedworks at Internet
Date: 4/29/97 11:05 AM
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Date: Tue, 29 Apr 1997 16:48:53 +0200
From: Jos Aarninkhof <[log in to unmask]>
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Subject: ASSEM: torsion/strength of soldered and glued SMD components
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Hello peers,
Is there anybody out there that can give me an answer on the question
what the minimal strenght should be of a soldered or glued SMD
component?
I can't find anything about it in different IPC-norms.
Best regards,
Jos Aarninkhof
e-mail: [log in to unmask]
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