Hello !
In IPC specification ANSI/IPC-RB-276, 1992, for "Qualification and Performance Specification
for Rigid Printed Boards" it is specified a copper thickness of 15µm for buried and blind vias
with a min.thickness of 13µm. However this spec. was changed during 1996, IPC-6012, there the
copper thickness for blind vias were increased to an average thickness of 25µm with a min.
thickness of 20µm.
Does anyone know why they changed their specifications?
Is there someone who has any experience of blind and buried vias with thin copper coatings
(15-13µm)?
Thanks in advance for your help
//Markus
Markus Gauffin M.Sc.
Printed Board Assembly Technology
tel: +46 8 719 16 34
fax: +46 8 719 71 99
e-post: [log in to unmask]
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