Specifically, my question concerns plating laminate that is 0.5 to 1 oz
copper over teflon with 1/8 to 1/4 inch aluminum back side.

(1) What is the best way to activate the aluminum surface prior to
plating?

(2) I am not so interested in the use of HF or KCN so I would like to
know if there are means to avoid these chemicals such as silicon free
aluminum alloy for example.  What are the tradeoffs?  Can one buy the
special aluminum alloy laminate?

(3)  How does one best achieve a plated through hole over the teflon
ring?

All responses are greatly appreciated whether general experience or
sales focus.

Thank you very much in advance,
(As one might expect this is a heat sink pcb)

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