 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0wMdMn-000BipC; Wed, 30 Apr 97 12:40 CDT |
| Content-Type: |
text/plain; charset="us-ascii" |
| Old-Return-Path: |
|
| Date: |
Wed, 30 Apr 1997 12:46:44 -0500 |
| Precedence: |
list |
| Resent-From: |
|
| Message-ID: |
<01BC5564.96017620@gateway> |
| MIME-Version: |
1.0 |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Status: |
|
| X-Loop: |
|
| Resent-Message-ID: |
<"zUbFa2.0.DAA.FGuPp"@ipc> |
| Subject: |
|
| From: |
|
| Content-Transfer-Encoding: |
quoted-printable |
| Resent-Sender: |
|
| Cc: |
|
| From [log in to unmask] Wed Apr 30 17: |
52:00 1997 |
| Parts/Attachments: |
|
|
John,
Try processing the panels thru an SP microetch, sulfuric rinse, then scrub with a fine grit "polishing" brush, then a final DI rinse with a forced hot air dryer. If available I would recommend using an aluminum oxide slurry spray instead of a mechanical scrub but most people don't have aluminum oxide so if possible use a really fine brush for the mechanical scrub. We found this cleaning sequence solved our adhesion problem a couple of years ago. It also solved a long time problem of peeling at the top of the contacts.
I hope this helps.
Ed Cosper
Director Quality Assurance and Engineering
Graphic Electronics
Tulsa OK
----------
From: LANmark Circuits,Inc.[SMTP:[log in to unmask]]
Sent: Wednesday, April 30, 1997 10:32 AM
To: [log in to unmask]
Subject: RE: FAB- LPISM
We've been battling a problem with LPI covering (tenting) larger vias (>.020).
There is a tendency for the mask to lift around these holes, particularly in
ground planes, at HAL. We've been drying the panels after scrub in a heated
board dryer and a quick bake in the oven. We are using Dynachem Epic mask.
Any input would be appreciated.
John Gordon
LANmark Circuits
LANmark Circuits,Inc.
400 Crown Point Circle
Grass Valley,Ca. 95945
(916)272-7280(voice)
(916)272-7017(fax)
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
