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Bill: OSP coatings can certainly by applied without the use of
conveyorized processing. You can use free standing tanks with vertical
immmersion. It would be similar to a manual black oxide line. Generically the
process would be; soak clean,rinse,microetch,rinse,OSP,rinse,dry.
The biggest problem you could be faced with is how to handle small
parts. Since the coating is typically applied as a final step after route,
unless the parts are large, panelized or in a carrier they are difficult to
process as individual small pieces using vertical slotted racks.
Regards
Michael Barmuta
Staff Engineer
Fluke Electronics Corp.
Everett Wa.
425-356-6076
On Fri, 25 Apr 1997 12:09:04 -0700 72030,3271 wrote:
> From: 72030,3271 <[log in to unmask]>
> Date: Fri, 25 Apr 1997 12:09:04 -0700
> Subject: FAB: OSP basics
> To: [log in to unmask]
>
> Hello again, Technetters...
>
> Due to the helpful responses I received on this forum recently, I have
> decided to pose another question about pcb fab:
>
> Although rare, we are seeing the Organic Solderability Preservative (OSP)
> requirement more and more on Request For Quotations. We would like to know
> if there is a low-volume/low-capital way to enter into this process.
> Can it be applied without conveyorized equipment? Any comments or
suggestions
> would be appreciated. Thanks!
>
> Bill Parlin
>
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