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56:08 1997 |
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Hello,
What would a typical peel strength be for copper foil to FR4 laminate? I
am familiar with peel testing adhesiveless flex, but I have no feeling for
the strength of the copper/FR4 interface.
In addition, how does the peel strength change with temperature exposure?
Is there a point (x # of times through a reflow oven for example) where the
adhesion drops to zero, and the SMT pads fall off of the substrate?
I apologize for my ignorance. I've only been exposed to flex and ceramic.
Thanks for the help,
Dave Anderson
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