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| From [log in to unmask] Thu Apr 3 08: |
43:11 1997 |
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Condor: 1. To activate the aluminum:
Alkaline clean
Nitric acid desmut
Zincate/strip/zincate
Copper strike electroplate
2. To eliminate HF use a low silicon alloy; 5000 series
3. For a plated thru hole treat the teflon with sodium
napthalene,alcohol rinse,process thru electroless Cu.
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett Wa.
206-356-6076
On Tue, 1 Apr 1997 16:05:27 -0800 [log in to unmask] wrote:
> From: [log in to unmask]> Date: Tue, 1 Apr 1997 16:05:27 -0800
> Subject: FAB: Copper/Aluminum Clad Teflon Plating
> To: [log in to unmask]
>
> Specifically, my question concerns plating laminate that is 0.5 to 1 oz
> copper over teflon with 1/8 to 1/4 inch aluminum back side.
>
> (1) What is the best way to activate the aluminum surface prior to
> plating?
>
> (2) I am not so interested in the use of HF or KCN so I would like to
> know if there are means to avoid these chemicals such as silicon free
> aluminum alloy for example. What are the tradeoffs? Can one buy the
> special aluminum alloy laminate?
>
> (3) How does one best achieve a plated through hole over the teflon
> ring?
>
> All responses are greatly appreciated whether general experience or
> sales focus.
>
> Thank you very much in advance,
> (As one might expect this is a heat sink pcb)
>
> [log in to unmask]
>
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