Hi Ron -
Take a look at JSTD-005 "Requirements for Soldering Pastes" - it has a
nice solder paste slump pattern that works well for many types of
slump variations. One additional check you may want to do - evaluate
your solder paste for slump AFTER component placement. Many solder
pastes do well in slump test in the as-printed configuration but fail
miserably after at component has been place on top of the print (for
20 mil pitch (and finer) components this is a big deal). Good Luck.
Dave Hillman
Rockwell Collins
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______________________________ Reply Separator _________________________________
Subject: Subj: Paste testing
Author: [log in to unmask] at ccmgw1
Date: 4/14/97 3:13 PM
Has anyone out there performed some hot and cold slump test? Have you
run accelerated hot slump tests on paste? If so at what temperatures?
Is there a test plan for these tests? If so, where can I find the
documents to follow the test plan?
Thanks
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