I am processing a board with pads that are gold plated. I am using OA
paste 63/37. All the pads are flowing good except for a QFP. Shorts are
appearing after reflow. The screen apertures are the same dims that i
normally use for HASL boards. The profile is set to the low side
temperature wise ( i tried a higher temp and it was just as bad). It
appears that the solder is not flowing evenly between the pads and the
leads. It is flowing more so to the leads than the pads. I also tried
applying a liquid OA flux to the leads of the QFP prior to reflow and that
made the shorts even worse. Anyone have any suggestions. Thanx
ahead.
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