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April 1997

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During PCB fabrication opens and shorts are major defects observed at ET. we conducted a DOE on a specific partnumber and found that every step change at primary imaging has a great degree of corrilation to Opens and Shorts. However the photoresist manufacturer specs are very wide 5 to 8 SST or 12 to 18 RST.Why are we finding a huge quality difference inside the specification ? How are you taking care of the above? 
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