Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset=US-ASCII |
Old-Return-Path: |
|
Date: |
Thu, 10 Apr 97 10:41:37 -0500 |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
Content-Transfer-Encoding: |
7bit |
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
X-Status: |
|
X-Loop: |
|
Resent-Message-ID: |
<"tZZqt.0.IpA.69HJp"@ipc> |
Subject: |
|
From: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0wFMWP-000BjNC; Thu, 10 Apr 97 11:16 CDT |
From [log in to unmask] Fri Apr 11 11: |
24:16 1997 |
X-Mailer: |
ccMail Link to SMTP R6.00.01 |
Message-Id: |
|
Parts/Attachments: |
|
|
If you wave solder you should consider the affect that via in pad has
on reflowing any top side QFPs or other components. The heat transfer
will (solder up throuhg the via down the trace or through the pad to
the topside soder joint) causing reflow.
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Via in Pad
Author: <[log in to unmask]> at INTERNET
Date: 4/10/97 9:43 AM
All,
I am designing a board that is about 100% package density. It is a
combination Digital and Analog design. It will be reflow top side only.
Most of the parts are small and do not have room under them for via's. Has
anybody used the Via in Pad technology? What has been you experience with
it? I realize that the Vias will tend to thieve the solder during reflow,
and cause problems.
Regards,
Fred Pescitelli
Phoenix Designs
1285 Turner Rd.
Lilburn, GA 30247
V-770-923-3465
F-770-923-2272
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|