IPC is hosting a meeting at Printed Circuits Expo on the Advanced 
Technology Program. The meeting will be held Wednesday, March 12, 8-10 a.m.
San Jose Convention Center, Room D (on main concourse level).  There is 
no charge to attend all are welcome.

A detailed description follows.

Regards
David Bergman, IPC


NEW OPPORTUNITIES FOR PARTNERSHIPS WITH THE NIST ADVANCED TECHNOLOGY PROGRAM.

In FY 1997, the Advanced Technology Program has solicited proposals in a
general competition and several previously launched focused competitions,
and has announced one new focused program.  Contact with U.S. industry is
being sought to promote participation in all current and future
solicitations, and to re-initiate the focused program planning process.  

The electronic packaging industry has been active in developing and
implementing roadmaps which identify enabling technologies and suggest
research and development priorities.  Because of the strong response in
1993 and 1994 to the initial program planning invitation by ATP, we are now
seeking to update our understanding of electronic industry needs as a first
step in considering a new initiative in this area.  Our goal is to
stimulate broad participation of the electronic packaging industry in ATP
partnerships, and assess the interest of this industry in defining possible
future program directions.

END



At 01:18 PM 2/26/97 -0800, you wrote:
>Here are the current details for our ATP Meeting:
>
>Wednesday, March 12, 8-10 a.m.
>Convention Center, Room D (on main concourse level, which is the same level
>the technical presentations are on; this is near the "J" rooms)
>
>

Michael A. Schen, Coordinator
Advanced Materials Program
Electronics Packaging, Interconnection and Assembly

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