Subject: | |
From: | |
Date: | Fri, 7 Mar 1997 11:01:57 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
There were also several papers on this subject presented at a session I
chaired at Surface Mount International, I think it was '95. Check with
David Gonnerman at Surface Mount Technology Assoc HQ, 612-920-7682 to
order.
>The information may be old but two papers were presented at the 1983
>NEPCON West. One was titled "How much gold is enough for electronic
>interconnections" by Will Reyes at Xerox. The other was "Palladium-
>Nickel as an alternative to Gold in connector applications" by Undegraff
>and Graham at du Pont. Some data regarding porosity, HNO3 testing,
>contact resistance, etc is included in the papers. I would be happy to
>share this information with you if you feel it is of any use.
> ----------
>From: es500yap@pts7
>To: [log in to unmask]
>Subject: FAB: Palladium Plating
>Date: Friday, March 07, 1997 5:00AM
>
>
>
>Does any have any experience with Pd plating replacing Selective Au &
>ENIG
>on
>PWB? Are there any success stories? Is there any data collected on the
>reliability of this plating? What is the plating thickness like for Ni,
>Pd?
> Is
>Au in the content? If yes, how much?
>
> Appreciate any input.
>
>
> regards,
> stella
>
>************************************************************************
>***
>* TechNet mail list is provided as a service by IPC using SmartList
>v3.05 *
>************************************************************************
>***
>* To subscribe/unsubscribe send a message <to: [log in to unmask]>
> *
>* with <subject: subscribe/unsubscribe> and no text in the body.
> *
>************************************************************************
>***
>* If you are having a problem with the IPC TechNet forum please contact
> *
>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]
> *
>************************************************************************
>***
>
>***************************************************************************
>* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
>***************************************************************************
>* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
>* with <subject: subscribe/unsubscribe> and no text in the body. *
>***************************************************************************
>* If you are having a problem with the IPC TechNet forum please contact *
>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
>***************************************************************************
***ALL NEW EMPF PHONE NUMBERS***
Jack Crawford, HelpLine Coordinator
Electronics Mfg. Productivity Facility
****NEW--317.655.3688
****FAX 317-655-3699
714 N Senate Ave, Suite 100
Indianapolis IN 46202-3112
VISIT OUR HOME PAGE AT: http://www.empf.org
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|