Hi Poh

In my opinion there is no way to clean the solder joints underneath a BGA.
You might even worsen the situation because the polymer matrix of the flux
residues close to the edge of the BGA will be cracked in a cleaning agent.
This solution is washed underneath your BGA and will contaminate the inner
row of balls even worse than they where before. Additionally, if you have
tracks underneath your BGA, the SIR between the tracks will be affected
with all the rubbish you wash under the component. We made trials with
QFP's, where we saw that residues are washed underneath the component but
that the rinsing operations where not able to remove the sauce accumulating
underneath the package.

Best regards

Guenter Grossmann


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