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TO: 14235700 IBMMAIL IBM Mail exchange
FROM: DWALLACE EX2 D.Wallace - Process Control Mngr Dunsdale
DATE: 6 March 1997
SUBJECT: Mylar removal on inners.
I am trying to obtain some user experience on mylar removal from
Multilayer Innerlayers prior to Develop / Etch / Strip.
Is there equipment available that can handle core thicknesses down
to 0.002"? If not, what is the minimum core thickness that can be
accommodated?
Ideally, I would want this equipment to operate at 3.5 Metres /
minute (minimum).
What method of removal is favoured?
Any input will be greatly appreciated.
David H Wallace
Process Control Manager.
Exacta Circuits Limited.
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