TECHNET Archives

March 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Sun, 2 Mar 1997 21:37:22 -0500 (EST)
Content-Type:
text/plain
Parts/Attachments:
text/plain (36 lines)
Trying to tent just one side of a via hole is certainly tricky. You are right
in that you might end up trapping some corrosive materials inside the via
hole (flux residues, for example) that you can't get out. This could be
especially risky on a life support board design, which you indicated.

Some suggestions might include:

1. Try to convince the customer to leave the via hole relieved on both sides.

2. Completed relieve the mask on the electrical test side of of the via hole
and bring the mask up onto the land area of the via hole on the other side.
This would alllow electrical testing on the one side and should prevent
shorts on the other side. It would allow the via hole to remain open and you
would trap no corrosive materials. You could accomplish this on your solder
mask artwork.

Hope this helps.

Regards,

Larry Fisher
Dexter Electronic Materials
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2