I am soldering J-leaded and gull-wing SM components with high temperature
solder and find that the tin/lead solder coating on the components interfere
with the integrity of the solder joint.  The retinning process and pot to pot
dipping is only partially successful and considerable amount of the tin-lead
solder is retained in the joints, also many of the components are not
availble with other final finishes.

I was going to use a tin-lead stripper, but some of my colleagues have had
problems with possible leakage and later failure of the components.
 Component bodies are both ceramic and plastic.

Any suggestions. 

Phil Hinton 
[log in to unmask] 
520-745-1013        

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