Hi,

I'm looking for information on backside (side 2) wave solder of surface mount
IC's.  Information about max temps, dwell times, temperature ramps, types of
flux, and the number of boards built this way would be helpful.  I'm not sure
of how common this process is, but I'd like to get the information to compare
with our test methods and product specifications.

Thanks in advance for your support,

Kirk Olund
QA Customer Engineering Manager
Fairchild Semiconductor
[log in to unmask]
(207)775-8597

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