TECHNET Archives

March 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Fw: Copper Peel Strength on microvia - dielectrics
From:
"Steve" <[log in to unmask]>
Date:
Sat, 29 Mar 1997 12:44:41 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines) 


----------
> From: Steve <[log in to unmask]>
> To: [log in to unmask]
> Subject: Copper Peel Strength on microvia - dielectrics
> Date: Monday, March 24, 1997 8:01 PM
> 
> Hi,
> 
> What is the best way to maximize Cu peel on dielectrics used in
sequential
> bulid on microvia designs?  We are testing several dielectric materials
in
> dry film and liquid applications.  We find plasma helps but feel ther are
> other methods that are less expensive and more conducive to productivity.
> 
> Thank you - Steve 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2