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March 1997

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Subject:
From:
Allen Hertz <[log in to unmask]>
Date:
Fri, 28 Mar 1997 08:56:55 -0500 (EST)
Content-Type:
MULTIPART/MIXED
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TEXT/PLAIN (1459 bytes) , TEXT/PLAIN (1124 bytes)
There have been mixed reviews. I am aware of one company which is in the process 
of completing a 1000 unit evaluation.

In the past, I have noted some solderability issues, and while addressing that 
found one interesting fundamental property: The solution temperature of Pd into 
eutectic Solder on a phase diagram is 231øC. Once we stumbled upon that 
information, all investigations were stopped.

Regards,
Allen

_______________________________________________________________________________

Subject: ASSY:ALTERNATIVES TO HASL

From:    [log in to unmask] at ftl03

Date:    3/27/97  6:33 PM



 DOES ANYONE KNOW ABOUT THE ADVANTAGES / DISADVANTAGES OF USING NiPd AS AN=20=
ALTERNATIVE TO HASL. I'M LOOKING FOR A FLATTER PAD SURFACE AND HIGHER YEILD=
 FROM MY FINE PITCH.

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