Subject: | |
From: | |
Date: | Thu, 27 Mar 1997 16:28:37 -0500 (EST) |
Content-Type: | Text/Plain |
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I have a customer who has a part data sheet that specifies 75ohm
impedance on Diff.Pair lines. The data sheet states that *trace
separation*
should be considered when calculating impedance!? The particulars
are as
follows: Embedded Microstrip <- this is my assumption
data rate - 1 gigabit/s
Mtl. - FR4
8 layer board
----------- trace outer(no copper will be allowed over special
sig.s)
----------- impedance routing layer 6 mil trace/? space <- this is
my assumption
10mils
----------- ref. plane
----------- trace inner
----------- trace inner
----------- ref. plane
10mils
----------- impedance routing layer 6 mil trace/? space <- this is
my assumption
----------- trace outer(no copper will be allowed under special
sig.s)
Can anyone help? Is this achievable? Please let me know if there is
any more
info. needed.
Regards,
Charles Emory, Sr. Designer/Web-master
Interconnect Design Services
6855 Jimmy Carter Blvd.
Suite 2890
Norcross, Ga. 30071
Email: [log in to unmask]
Ftp : idspwbs.com (call for login and password)
WWW : www.idspwbs.com
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