The current revision of this spec is NHB5300.4(3A-2)  (January 92)

We are using an aquious cleaner for all the boards we clean here, but we 
don't have much volume & hand solder most (I think actualy all) our boards.

We are working under the 3A-2 (and 3G-1,3H,3J...)

We use mostly watersoluble fluxes, except for hand solder & rework.

All boards are cleaned with the aquious cleaner.  I believe we check 
with an omegameter.  The initial work thru for NASA we tested the water
sepprately for contaminits.  We also wrote a suppliment (approved by GSFC)
to the 3A-2 to clarify certian aspects of the spec & define allowable conditions
(white residue after cleaning, lead overhang, ect ~9pages)  this was a long
process, but well worth it when it's time to submit material to the customer.

Bill Gaines
AeroJet

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************