TECHNET Archives

March 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Johannes Sivula"<[log in to unmask]>
Date:
Wed, 26 Mar 1997 17:13:43 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)


Hi Techneters,

Does anyone  know how to define  or search up the  max. period of time a
component in a plastic package stands   the heat of wave soldering&reflow
process ? For exampel  transistors and diodes in a packages  like SOD 106
or  SO20.
Databooks of suppliers seem to be of  no use.

Brs, Johannes Sivula, Tellabs Oy


***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2