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March 1997

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Subject:
Assembly: Solder plating height for TAB bonding
From:
"Donal O'Keeffe" <[log in to unmask]>
Date:
Wed, 26 Mar 1997 10:11:13 GMT
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Technet,

        What solder plating height should I use for 0.18mm space (0.36
pitch) TAB sites on a PCB?
The TAB leads are tin plated, and the OLB process is Hot-bar. Is the height
dependant on the solder composition? 

A 'no-clean' flux is proposed to avoid cleaning difficulties beneath the
TAB, is there a specific product you would recommend for this application?

Best regards,
Donal O'Keeffe
ViewLight Systems Ltd

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