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March 1997

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Subject:
Copper Peel Strength on microvia - dielectrics
From:
"Steve" <[log in to unmask]>
Date:
Mon, 24 Mar 1997 20:01:47 -0500
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Hi,

What is the best way to maximize Cu peel on dielectrics used in sequential
bulid on microvia designs?  We are testing several dielectric materials in
dry film and liquid applications.  We find plasma helps but feel ther are
other methods that are less expensive and more conducive to productivity.

Thank you - Steve 

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