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March 1997

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Mon, 24 Mar 1997 17:20:40 -0500 (EST)
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Hi Dennis,
Calibrating the oven controls does not do it, you need to profile with test
PCAs.
I am not sure what relevance ISO and or military calibration standards have
with regards to the proper profiling of solder reflow ovens. In any case, you
need to use appropriate representative test PCAs properly instrumented with
thermocouples to measure the temperature at the most critical locations, i.e.
solder joints on the largest components with the greatest thermal mass which
are likely to heat up the slowest. The profil needs to assure that even the
slowest heating solder joint will reflow and wet every time. You may also
have a thermocouple on a PWB surface pad to measure the maximum temperature
reached by the PWB which is important fot PTH/PTV reliability. 

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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