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March 1997

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From:
Chris Hunt <[log in to unmask]>
Date:
Mon, 24 Mar 97 09:32:29 GMT
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See SMI proceedings, Sept 1996, p650

Chris Hunt

___________________ Forwarded Message _____________________

Date: Fri, 21 Mar 97 17:31:00 GMT  
From: Yuen, Mike
To: [log in to unmask]
Subject: Mechanical Properties: Intermetallic Thickness!



Related question on mechanical properties!

Are there any publications out there documenting  the adverse impact(s) of 
excessive intermetalic growth of  Eutectic Solder (Not Gold Embrittlement 
just regular Cu3Sn and  Cu6Sn5)?

Thanks



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