Jenni,

A company that might be able to help you is:

Circuit Repair Corporation
108 Turnpike
Rowley, MA,  01969, USA
Phone: 508-948-7973
Fax:      508-948-2365

Ed Wong
Wongtronics Labs

On Wed, 19 Mar 1997 10:51:05 -0700 "Marcy, Jenni A"
<[log in to unmask]> writes:
>We are about to embark on using microvia or sequential build-up 
>technology 
>to put small vias in the surface mount pads on our boards.  Part of 
>our 
>qualification process entails understanding the reworkability of the 
>boards 
>which contain Dycostrate/PERL technology.  We have detected pad 
>lifting 
>after 3 rework cycles, however the lifting is not so substantial as to 
>
>require re-epoxying.  The pad would likely be trimmed and replaced.  
>Has 
>anyone out there established guidelines for the extent of pad lifting 
>before relabiltiy and/or quality is impacted?  Is anyone else 
>experiencing 
>pad lifting with these technologies.?  Thanks in advance.
>Jenni Marcy
>Sr. Sourcing Engineer
>Storage Technology Corp.
>Louisville, Colorado
>
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