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March 1997

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Subject:
FAB: Silver-Fill
From:
[log in to unmask] (Karl Sauter)
Date:
Fri, 21 Mar 1997 10:30:40 -0800
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We are considering use of silver-filled vias for some
via-in-SMD land applications.  These would be through
hole vias on .062" thru .200" thick boards, where the
vias need to be topped over and plugged from one side
only.  Who has experience with this and what vias
finished hole sizes work best?

Thank you.

Regards,
Karl Sauter
Sun Microsystems, Inc.
408 276-5499

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