I'm Investigating mechanical failures (cracking) of solder joint for
J-leaded surface mounted components (SOJ). The primary casue is due to
the CTE mismatch between the PWB and the cermic SOJ.
Any sources of information for the following?
Stress/Strain relationship of eutectic solder (63 Sn, 37 Pb)
Any alternatives for mounting these J-leaded devices using the same
footprint?
Any similar experiences to this type of problem and how was it solved?
Hans Ohman
Mechanical Engineering
DY4 Systems Inc.
Kanata, Ontario
[log in to unmask]
613 599 9199 x536
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