Classification:
Prologue:
Epilogue:

Specifying a thickness of Au of less than 10 microinches should leave you with
so little Au, that it will diffuse into the solder joint below the critical %
needed to ensure a reliable solder joint, without the need to pre-tin the leads
of the component.

Jim Herard
Quality Engineering
IBM Microelectronics





        TechNet-request @ ipc.ipc.org
        03-18-97 07:55 AM


To: technet @ ipc.org@internet
cc: ROLF.THUNSTROM @ JKP.dynamics.unisource.nl@internet, BO.ALPTEG @
JKP.dynamics.unisource.nl@internet, BO.DALSTROM @
JKP.dynamics.unisource.nl@internet
Subject: ASSY: Gold in the solder connection #2

[correction to my previus mail]

Hi friends,
In order to  make high produceability in the soldering process of boards,
surface mounted, it is necessary to prepare the gold plated components before
assembly. This is stated in ANSI/J-STD-001, which does not allow any gold at all
on the component legs.

Is it, anyway, possible to specify a limit of gold thickness on the comp.
connections, below which it is not necessary to extract the gold before
soldering? Does anyone have a opinion about that?

Sven-Eric Backstrom
Ericsson Saab Avionics
Sweden


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