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March 1997

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Subject:
OSP versus HASL
From:
"Johannes Sivula"<[log in to unmask]>
Date:
Tue, 4 Mar 1997 15:10:30 +0300
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Hello Techneters,



Is there any difference between these 2 finishing methods as far as
solderability is concerned ? We use multilayer boards ( up to 14 layers,
densely populated with up to 19 BGA`s on a board. I am concerned about
this issue. Maybe Immersion Gold would have been the best choice ?


How about conductivity in via´s (IC-testing ) ?

Thanks in advance. Every comments are highly appreciated.
Brs

[log in to unmask]




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