Ditto on the inquiry to compliancenet.  Please respond directly to Cathy 
Chang.  

Thank you.

---------- Forwarded message ----------
Date: Wed, 19 Mar 1997 12:09:15 -0500
From: Holly Lynch <[log in to unmask]>
To: "[log in to unmask]" <[log in to unmask]>
Subject: elimination of etch resists through differential etching

Does anyone have any information on this issue for this graduate student?  Please reply directly to [log in to unmask]

Thanks!

----------
From: 	Cathy Chang[SMTP:[log in to unmask]]
Sent: 	Wednesday, March 05, 1997 8:44 PM
To: 	[log in to unmask]
Subject: 	elimination of etch-resist


I'm currently working on my graduate research which involves evaluation of
lead-free P2 measures (conductive adhesive, tin-only plating and LLNL's
proposed technology) to be used in place of etch-resist or soldering for
printed circuit board production.  

LLNL is currently developing an improved etching process
that will eliminate the use of etch-resist by employing differential etching
based on manipulation of copper grain chemistry. When Dr. Duke and I visited
one of the PWB facilities for a tour, we were told that Japanese PWB
industry is (or has) working on similar technology which eliminates the use
of etch-resist in PWB manufacture.  We are trying to get our hands on
literature that might give us more info. on the kinds of technology that
falls into this category (since we don't know exactly what this technology
is at the present time).

So, if anyone has any insights on the issue, I'd love
to hear about them.

Thank you

Cathy Chang
e.mail: [log in to unmask]

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