>From what I have read, Immersion Gold plating on nickel is a "self
limiting" process.
  My question is what is, what is the limit?  I have received conflicting
answers
 (i.e. 0.1 micron, 0.2 micron, etc...).   If I wanted less than the limit,
how controlled is the
 immersion process to allow me to spec. a specific amount of gold?  Also,
what is the
recommended minimum amount of gold that should be on the nickel?

I have also read that the gold content in the solder should be maintained
below 2%.  Is this
just a matter of adding more solder paste?

One last matter.  Does anyone know of place I can send Nickel/Gold plated
boards to have
the amount of gold plating verified?

Thank you all in advance!

Best Regards,

Mike Forrester
LeCroy Corp.
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