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March 1997

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Subject:
FW: DesignRules Wire and Ribbon Bonding
From:
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Date:
Tue, 18 Mar 97 18:28:23 PST
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Dear collegues ,


We are developping a designrulebook for design for manufacturing of
Au Thin Wire Wedge/Wedge  and Ribbon Bonding especially for High Frequency 
Applications.

Is there anyone,  who knows  designrules for DFM for  similar or  other 
wire/ribbon bond applications  coming from the Chip on board technology. May be that there still exists a structure for such a Designrulebook.

I think it makes sense to work together in a userforum  on this matter.

Is  there anyone  who is interested in this matter ?

Thank You very much

M. Jeremias

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