Hello everyone!!

I've a customer who is using a Fine Pitch solder paste (25-45 microns
powder) in SnPb2Ag. 
His problem, is the multiple appearance of Macroballs in the QFP component legs.
He is convinced that the problem is a bad preheating and a wrong reflow
curve, but he has changed the oven parameters and the Macroballs continue
appearing.
Could anyone confirm me if the problem is located in the serigraphy?
I supose it, because, he is printing with a 200 mesh mask and the cream in
Fine Pitch.
Best regards

                   

                     =============
                     ANTONI CHERTA
                         (Barcelona)
                   Ph:+34.07.20.49.42
                   Fx:+34.3.274.00.80
            E-mail: [log in to unmask]
            =====================

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************