I am working to resolve a problem in pattern plating a panel which has a ground
plane on one side (40% plated panel area) and pads on the back side (6% plated
panel area).  We use modern DC rectifiers, one for each side, which share the
cathode connection.  The panels overplate the back (6%) side even with the
corresponding rectifier turned off.   Our only solution was to place current
robbers on the back side which are selectively etched off in a later operation.  
I have been given information that "pulse plating" could allow us to plate this
design with out any modifications to the plating areas.  My question is:

1. Does anyone currently use "pulse plating" in a pattern plating operation?
2. Would this technology make plating this type of unbalanced design easier?
 

Thanks,        Rick Haynes
	       Texas Instruments Printed Circuit Resources
	       512-250-7823   [log in to unmask]