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Subject:	ASSY: Gold in the solder connection.
From:	SVEBA <[log in to unmask]>
Date:	Tue, 18 Mar 1997 12:39:32 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (26 lines)

Hi friends,
In order to  make high produceability in the soldering process of boards, 
it is necessary to prepare the gold plated components before assembly. This is
stated in ANSI/J-STD-001, which does not allow any gold at all on the component legs.

Is it, anyway, possible to specify a limit of gold thickness on the comp. connections, below which
it is not necessary to extract the gold before soldering? Does anyone have a opinion
about that?

Sven-Eric Backstrom
Ericsson Saab Avionics
Sweden


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