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March 1997

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Subject:
From:
Ed Cosper <[log in to unmask]>
Date:
Mon, 17 Mar 1997 14:50:33 -0600
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Rudy,

Being able to monitor the elements that product the end result is the whole point of SPC. When you can minimize the variation of the process elements, then the probability of consistently producing the same result is increased. You must still monitor the line width to determine the true process capability since that is the end items you primarily trying to achieve by controlling the process.

Simply put,  we know that in etching, the speed, pressure, pH, temperature, and copper content has the most significant effect on the end item line width,

Therefore, the less variation there is in the contributing elements, the  more consistent the ending line width will be.

Hope this helps,

Ed Cosper 

----------
From:  [log in to unmask][SMTP:[log in to unmask]]
Sent:  Sunday, March 16, 1997 5:45 AM
To:  [log in to unmask]
Subject:  Re: REQUESTED SPC INFO ( 5 PAGES)

To this end, would like to ask what may be naive question, but oh well...

In the ideal world, does SPC want to measure results of a process, such as
line width produced in a developer or etcher, or does it want to measure
process conditions, such as pH in a developer or etcher?

Guess the reason why I ask is that if measuring process conditions is at
least partly the answer, we should likely have some input as to what is best
things that should be measured in each process.   The industry is moving
towards new areas here.

Rudy Sedlak

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