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March 1997

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Subject:
From:
[log in to unmask] (starr devere)
Date:
Mon, 17 Mar 1997 08:42:55 MST
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Looking for options & suggestions regarding how to improve wettability of
Pd-Ag terminated parts using eutectic, water soluable, organic acid
resin, convection reflow  solder process.

Current SMT Process: 
Alpha WS609 solderpaste / conv. reflow / hot DI water wash

I have a board designed with varistors that are supposedly only available
with Palladium-Silver terminations.  The standard process results in
unacceptable yields due to poor wettability.  

Options/Ideas so far:        PROs                    CONs
-------------------------    ---------------------  
----------------------
Change solderpaste alloy     better wetting          extra process
Modify reflow profile        better wetting          none
Different atmosphere         better wetting          extra cost
Solder dip terminations      better wetting          extra cost

Are there any other suggestions or comments about ways to improve
wettability?

Can anyone recommend an inexpensive supplier to solder dip the parts?

Thanks in advance for your comments.

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