It looks like your fabrication problem is due to the large hole size.
Assuming .030 is the actual drill size (not the finished size), you have
.007 from trace to hole. This number should be greater than .010
(depending on board size, materials used etc.). Is there any way you can
route this board without running traces between pads on .050 pitch? Can
the hole size be reduced?

Nick Wander
Unisys, Roseville, MN
>----------
>From: 	K.Varadaraj@CADET, India.[SMTP:[log in to unmask]]
>Sent: 	Saturday, March 15, 1997 2:21 AM
>To: 	[log in to unmask]
>Subject: 	50 mil pitch/30mil drill component, with 6 mil routing.
>
>Hello
>
>
>I would like to know if fabricating an SMD (double side mount), Six layer
>PCB, which has a 50 mil pitch pin to pin and 100 mil pitch row to row, 44
>pin connector, is possible any where. The drill provided is 30 mil and the
>pad is 32mil x 80 mil, oblong. Six mil track is routed between the pins.
>
>We have had a vendor fabricate this board here in India and due to process
>tolerances, the yeild is very less or almost has been nil.
>
>Information on the fabricators or an alternate solution in pad/track
>design is very much appreciated.
>
>
>thanks
>
>k.varadaraj
>
>fm: K.Varadaraj, CADET Automation Systems, India.
>    Ph: 91-80-665 7215, Fax: 91-80-528 0101
>    email: [log in to unmask]
>
>
>

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