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March 1997

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Subject:
FAB: Resin Recession
From:
Yud <[log in to unmask]>
Date:
Tue, 04 Mar 1997 01:21:47 +0200
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Gerry,
You asked about our findings regarding resin recession.

We treat resin recession according to MIL-P-55110D (I don't remember which
paragraph) that allowed the following: 
- Resin recession on Max. 50% of the dielectric hole wall on "as received"
samples. 
- Unconditioned resin recession after thermal shock.

We hardly ever see resin recession on "as received" boards and we see a very
low extent (less then 10-15%) recession on samples after thermal shock.
What I must add to this is that we are working with an IR reflow process
(not  HASL) and that most of our multilayer boards are polyimide.

Hope that it helps,
Yehuda Weisz
    ************************************* 
    *          Yehuda E. Weisz              *
    *  e-mail: [log in to unmask]   *
    *  Tel: 972-3-5240362                    *
    ************************************

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