To this end, would like to ask what may be naive question, but oh well...

In the ideal world, does SPC want to measure results of a process, such as
line width produced in a developer or etcher, or does it want to measure
process conditions, such as pH in a developer or etcher?

Guess the reason why I ask is that if measuring process conditions is at
least partly the answer, we should likely have some input as to what is best
things that should be measured in each process.   The industry is moving
towards new areas here.

Rudy Sedlak

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