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March 1997

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From:
[log in to unmask] (Dave Willhard)
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Date:
Fri, 14 Mar 1997 16:14:16 PST
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Technet,

We use an X-ray flourescence scope to measure solder
thickness and composition. Recently, we sent samples
to a university to have the composition measured by
Edacs (I probably spelled that wrong). In case I 
spelled that wrong and you don't know what I mean -
Edacs composition measurements are a by-product of
scanning electron microscopes. Anyway, the tin-lead
percentages we got from Edacs were way different from
the results we got on our X-ray. I'm thinking this
might be because the Edacs measures an extremely small
surface area whereas the X-ray measures a 5 to 10 mil
diameter circle.

Does anyone have any experience with SEM and/or Edacs
in relation to solder composition? We would appreciate
any info to confirm my theory or refute.

Thanks,
Dave Hall
[log in to unmask]

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