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| Date: | Thu, 13 Mar 97 13:28:05 EST |
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De: Coderre - JCCODERR BRMVM1
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UNCLASSIFIED UNLESS OTHERWISE SPECIFIED
Objet: Gold Thickness on Pads
As a solderable finish, immersion gold over a nickel is suitable.
Immersion gold is a self-limiting process whereby the plating
stops when ion-exchange can no longer occur. This is typically in the
0.1 micron range.When components are soldered, all the gold is dissolved
in the solder, the joint is made with the nickel....Gold embrittlement
is a concern but should not be a problem when the gold content in the
solder is maintained below 2% (some will claim 3%, others 4%). This
will translate in thicknesses in the micron range, well above
the maximum attainable thickness obtainable with an immersion
system. Hence the self-controling nature of this surface finish.
Hope this helps. Please call or e-mail if additionnal information
is needed.
Merci/Regards
OEM Products and New Business Opportunities
Dept 881/23 BRMT (tel. 514-534-6591)
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*** R(c)acheminement de la note de SMTP2 --IINUS1 03/13/97 12:57 ***
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