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March 1997

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Subject:
Re: Solder Mask on fine pitch SMT component
From:
[log in to unmask]
Date:
Thu, 13 Mar 97 07:26:38 PST
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     We don't specify SM between pads on .020 pitch. Our assembly people 
     have no significant problems with this design.
     
     
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: Solder Mask on fine pitch SMT component
Author:  [log in to unmask] at _internetcc
Date:    3/12/97 5:46 PM


Hello
     
I am facing a problem with fine pitch SMT component of 20mils. How can = 
the soldermask be applied in between the pads without covering them? My = 
supplier claims that their process capability is restricted.
     
Another Question:
Which PCB manufacturing house in Singapore can produce 6mils = 
trace/air-gap (for internal layers as well) specifications?
     
     
Please Advice...Thanks
     
     
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