In a message dated 97-03-12 03:36:08 EST, you write:

>We started to work with our new line of electroless Ni-Au finishing. We have
>some problems , that seems to be similar to those , that were discussed 3
>weeks ago in the net . We observed several phenomenas, that are confusing us
>:
>1 ) Usually , we are adding to working basket brushed , double sided pannels
>just to have enough surface , as reguested by loading factor . I happend ,
>that one of those pieces got Nickel on one side , while the the second side
>was vitrually not plated . Production boars were plated correctly .
>2 )  We observed , that some pads on MLB are not plated .We found out , that
>they are electrically connected .
>3 ) As far as  we know , double sided boards are not affected by " selective
>non-plating "
>
>We have a filling , that this problem is somehow connected with the network
>on the board . We don`t know , how to define the reasons and how to overcome
>the problems .
>
Sounds like some/much of this could be developing/cleaning issues, at least
if you are using a photoimageable soldermask.  Why not give us a hint as to
what you are using for a soldermask, and what you do to the boards after
applying soldermask, whatever type you are using.

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