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Subject:	Solder Mask on fine pitch SMT component
From:	Andy <[log in to unmask]>
Date:	Thu, 13 Mar 1997 09:38:07 +0800
Content-Type:	text/plain
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Hello

I am facing a problem with fine pitch SMT component of 20mils. How can the soldermask be applied in between the pads without covering them? My supplier claims that their process capability is restricted.

Another Question:
Which PCB manufacturing house in Singapore can produce 6mils trace/air-gap (for internal layers as well) specifications?


Please Advice...Thanks


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