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March 1997

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Subject:
From:
"George Franck" <george@[11.1.1.33]>
Reply To:
Date:
Mon, 3 Mar 1997 15:41:51 -0500
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Gerry
I am going to go WAY, WAY, WAY out on a limb here, but maybe your
real problem is that you removed all your non-functional pads.

Just a hunch.
-- 
George Franck
Principal Product Engineer
Raytheon E-Systems
Falls Church Va

On Mar 3,  1:32pm, D'Auteuil, Gerry wrote:
> Subject: RE: Resin Recession
...
... ----------
...   
...
...I have a question with regard to Resin Recession prior to
thermal stress.
...  Both IPC-600 and 6012 only indicate an acceptable condition
after   
...thermal stress.  There is no mention of the acceptability of
resin   
...recession after HASL.  I am looking to find any information
which I could   
...supply to one of my accounts that would indicate what the
criteria would   
...be prior to thermal stress.   MIL-P-55110 paragraph
3.6.2.1.10.1 has a   
...criteria prior to thermal stress.
...This product is also in excess of 175 mils thick.  We have
also recently   
...moved to aprox. 175 degrees C,Tg material to alleviate lifted
lands but   
...we are now seeing more resin recession.  Would someone at
TechNet  or IPC   
...be able to comment on their views or  findings for Resin
Recession prior   
...to thermal stress?
...
... Thank you
... Gerry D'Auteuil
...E-Mail [log in to unmask]
...
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>-- End of excerpt from D'Auteuil, Gerry


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